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Critical for high-efficiency grinding and dispersion of cathode materials (lithium iron phosphate, ternary precursors), silicon anodes, and solid-state electrolytes, achieving nano-scale particle size with minimal contamination.
Used for fine grinding of rare earth magnets (neodymium-iron-boron, ferrite) and magnetic recording media, delivering superior wear resistance and maintaining product purity.
Applied in grinding and dispersion of structural ceramics, electronic ceramics, and ceramic powders requiring ultra-fine particle size and high purity.
Ideal for high-end automotive coatings, industrial paints, and functional coatings where exceptional color consistency, gloss, and dispersion quality are required.
Used for producing high-quality digital inks, ceramic inks, and conductive inks, ensuring stable dispersion and precise particle size control.
Employed in wet grinding of pharmaceutical active ingredients and bio-materials where ultra-fine particle size and zero contamination are critical.
Applied in production of high-performance pesticide suspensions and crop protection formulations requiring stable nano-scale dispersion.
Used for grinding electronic pastes, dielectric materials, and advanced functional materials for semiconductor and display applications.
Technology: Sintering
Size: 0.4 – 15 mm
Specific Density: 5.95 – 6.2 g/cm³
Bulk Density: 3.9 g/ml
Hardness: 1200 HV1
Available Sizes (Sphere):
| Items | Unit | Parameter |
|---|---|---|
| Composition | wt% | 78～80% ZrO₂ / 13～20% CeO₂ |
| Bulk Density | Kg/L | 3.8 (Φ7mm) |
| Specific Density | g/cm³ | 5.95 ～ 6.2 |
| Hardness (HV) | GPa | > 9 |
| Elastic Modulus | GPa | 200 |
| Thermal Conductivity | W/m·K | 3 |
| Crushing Load | KN | ≥ 10 (Φ7mm) |
| Fracture Toughness | MPa·m¹/² | 8.5 |
| Grain Size | µm | ≤ 0.5 |
| Thermal Expansion Coefficient (20–400 °C) | 10×10⁻⁶ / °C | 9.0 |
